| Customization: | Available |
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| CAS No.: | Copa Hot Melt |
| Formula: | Copa Hot Melt |
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| Melting point ºC 90-100 |
| Melt flow rate(2.16kg) 160ºC g/10min 5 |
| Particle Size Distribution(PSD) |
| Pressing temperature |
| Density g/cm³ 1.1 |
PA5703-HJ is an ultra-low temperature high-performance copolyamide hot melt adhesive granule product. It is mainly used spinning, adhesive films, and special material coatings, suitable for cast or roll coating processes, and has a high modification base that can be used as a modifier for material additives. It features an ultra-low melting point, excellent chemical resistance, low bonding temperature, and high strength. It also exhibits excellent resistance to yellowing
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