Co-Polyamide Hot Melt Adhesive PA5703-Hj Low Temperature

• Customization: Available
• CAS No.: Copa Hot Melt
• Formula: Copa Hot Melt
• Model NO.: PA5703-HJ
• Bonding Function: Cryogenic Adhesive
• Morphology: Particle
• Application: Spinning; Gel Film; Special Material Coating
• Material: Co-Polyamide
• Classification: Hot Melt
• Main Agent Composition: Co-Polyamide
• Characteristic: Particle
• Promoter Composition: Tackifier
• Composition: PA
• Color: Clear
• Purpose1: Spinning
• Purpose2: Gel Film
• Purpose3: Special Material Coating
• Feature1: Ultra-Low Temperature
• Feature2: Yellowing Resistance
• Processing Method: Cast or Roll Coated
• Transport Package: Bag
• Specification: 25KG
• Trademark: HUIJU
• Origin: China

Product Description

 

Melting point                                                                                                     ºC                                90-100

Melt flow rate(2.16kg)                                                                                       160ºC       g/10min       5

Particle Size Distribution(PSD)                                                                                                     

Pressing temperature                                                                                        

Density                                                                                                                               g/cm³           1.1

 

 

PA5703-HJ is an ultra-low temperature high-performance copolyamide hot melt adhesive granule product. It is mainly used spinning, adhesive films, and special material coatings, suitable for cast or roll coating processes, and has a high modification base that can be used as a modifier for material additives. It features an ultra-low melting point, excellent chemical resistance, low bonding temperature, and high strength. It also exhibits excellent resistance to yellowing

 

COPA(0-80μm) is suitable for adding to adhesive pastes, with process applications including screen printing paste, hoting adhesive, and flocking paste.

 

COPA (80-170 μm/150-250 μm) is suitable for powder spreading/lining double dot. Industry applications: Clothing lining (simple bonding process with good bonding strength and softness, both bonding and sealing), automotive interior (corion-resistant, fatigue crack-resistant, good sealing, and low resistance), footwear industry (solvent-free, non-flammable, good melt fluidity, adhesion, uniformity of the coating), and textile fabric rhinestone bonding industry.

 

Textile fabric with rhinestones (0-80μm or 0-120μm for small stones, 8-170μm for medium stones, 150-250μm for large stones)